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Journal papers 2023

  1. O’Toole L., Haridas R. S., Mishra R. S., Fang F. Z., Determination of Johnson-Cook plasticity model parameters for CoCrMo alloy. Materials Today Communications. 2023; 34: 105128. DOI: 10.1016/j.mtcomm.2022.105128.

  2. An H. J., Wang J. S., Fang F. Z., Material removal on silicon towards atomic and close-to-atomic scale by infrared femtosecond laser. Materials Science in Semiconductor Processing. 2023; 158: 107368. DOI: 10.1016/j.mssp.2023.107368.

  3. An H. J., Wang J. S., Fang F. Z., Removal of SiC at atomic and close-to-atomic scale by nanosecond ultraviolet laser. Optics & Laser Technology. 2023; 158: 108863. DOI: 10.1016/j.optlastec.2022.108863.

  4. Geng Z. C., Huang N., Castelli M., Fang F. Z., Polishing approaches at atomic and close-to-atomic scale. Micromachines. 2023; 14(2): 343. DOI:10.3390/mi14020343.

  5. Bi G., Li Y., Lai M., Fang F. Z., Mechanism of polishing lutetium oxide single crystals with polyhedral diamond abrasive grains based on molecular dynamics simulation. Applied Surface Science. 2023; 616: 156549. DOI: 10.1016/j.apsusc.2023.156549.

  6. Wang J. S., Fang F. Z., An H. J., Wu S., Qi H. M., Cai Y. X., Guo G. Y., Laser machining fundamentals: micro, nano, atomic and close-to-atomic scales. International Journal of Extreme Manufacturing. 2023; 5(1): 012005. DOI: 10.1088/2631-7990/acb134.

  7. Wang P. Z., Castelli M., Fang F. Z., Mechanism of photo-assisted atomic layer etching of chlorinated Si (111) surfaces: Insights from DFT/TDDFT calculations. Materials Science in Semiconductor Processing. 2023; 153: 107169. DOI: 10.1016/j.mssp.2022.107169.

  8. Fang F. Z., The three paradigms of manufacturing advancement, Journal of Manufacturing Systems. 2023; 63: 504-505. DOI: 10.1016/j.jmsy.2022.05.007.

  9. Shen M. Y., Fang F. Z., Two-step electropolishing of internal surfaces of 316L stainless steel made by laser-based powder bed fusion. Journal of Manufacturing Processes. 2023; 89, 298-313. DOI: 10.1016/j.jmapro.2023.01.052.

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